Static dissipative polyimide labels withstand wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling.
- Low-profile, high-temperature, glossy white polyimide material features a static dissipative adhesive and static dissipative release liner
- Surface resistivity values in the recommended range for dissipative ESD packaging materials as defined by ANSI/ESD S541-2008
- UL approved and meets requirements of MIL-STD-202G, Method 215K
- Service temperature of -94° to 212°F (-70° to 100°C)
- Surface resistivity meets ANSI/ESD S541-2008 recommended range for Dissipative ESD packaging materials
- UL Approved; Meets requirements of MIL-STD-202G, Method 215K
- Service temperature of -94 to 212° F (-70 to 100° C)
Specifications
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Material Characteristics |
Material Number |
B-768 |
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Material |
Static Dissipative Polyimide |
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Material Properties |
Harsh Flux Wash-resistant |
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Label Properties |
Electrostatic Dissipative, Heat Resistant, Permanent Adhesive |
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Adhesive Type |
Static Dissipative Permanent Acrylic |
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Finish |
Gloss |
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Color |
White |
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Resistance Properties |
Abrasion-Resistant, Chemical-Resistant, Corrosion-Resistant, Humidity-Resistant |
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Indoor or Outdoor Use |
Indoor Use |
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Service Temperature Range °F |
-112 °F – 572 °F |
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Minimum Service Temperature °F |
-112 °F |
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Maximum Service Temperature °F |
572 °F |
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Compatible Surface Types |
High Surface Energy |
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Product Features |
Application |
Circuit Board Labeling, Component and Equipment Labeling |
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rinting Specifications |
Print Technology |
Thermal Transfer |
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Compatibility |
Printer Compatibility |
i5100, i7100, IP Series, PR Plus, THT 3″ Core Printers |
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Recommended Ribbon |
IP-R6300 Series, R6300 Series |
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